noncontact 3D measuring measures the surface shape of a fine pattern with a height of 1nm ~ 10mm using light interference. Compared to AFM or contact profiler, it is possible to realize a wide measurement area and high speed, and it has a powerful advantage of measuring 3-dimensional shape on the surface without damaging the measurement object.

==Semiconductor==
Stud Bump : Diameter, Height, Volume, Roughness, Angle
 CMP :  Warpage, Roughness 
 CVD : Roughness 
 Wafer : Warpage, Scrach, Roughness
==LCD/OLED==
Photo Space : Diameter, Height, Width, Volume
 RGB : Thickness, Roughness, BM Thickness 
TFT Pattern : Height, Width, Roughness  
 BLU : Shape, Width, Height, Angle, Roughness
 Ink Jet : Width, Height, Angle, Roughness
 Glass : Defect Form/Width/Height,
 OLED : Thickness & Shap
==PCB Substrate==
Substrate (Pad, Trace, Space, Anchor, Land, Ball Pad, Via Hole, Dimple, SR) 
   :  Height, Width, Depth, Dia, Thickness, Volume, Roughness, Roundness
 BGA : Ball Height, Dia,Coplanarity     
==Etc==
MEMS : Height, Width
 Precision machine part : Roughness 
 Laser Marking : Depth, Volume
 Inkjet : Volume, Height, Area  
 Micro Lens : Curvature
 RFID : Height, Width, Roughness    

==Hardware==
- Equipment
- Isolation Table
- Table
- Computer
- Monitor
==Software==
- Surface View(Opperator Program)
- Surface MAP (Analysis Program)